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date accessioned2020-03-12T19:38:43Z
date available2020-03-12T19:38:43Z
date issued2014
identifier other6787326.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/984730?show=full
formatgeneral
languageEnglish
publisherIEEE
titleModeling CPU Energy Consumption of HPC Applications on the IBM POWER7
typeConference Paper
contenttypeMetadata Only
identifier padid8100230
subject keywordsCMOS integrated circuits
subject keywordsannealing
subject keywordscontact resistance
subject keywordselemental semiconductors
subject keywordsion implantation
subject keywordsphosphorus
subject keywordsselenium
subject keywordssilicon
subject keywordstitanium compounds
subject keywordsCMOS performance scaling
subject keywordsNMOS contact resistivity reduction
subject keywordsSe
subject keywordsSi:P
subject keywordsTiSi<
subject keywordssub>
subject keywordsx<
subject keywords/sub>
subject keywordsdamage engineered selenium implant
subject keywordsimplant energy optimization
subject keywordsin-situ epitaxially doped n-SD regions
subject keywordslow specific contact resistivity
subject keywordsmillisecond laser annealling
subject keywordsAnnealing
subject keywordsContacts
subject keywordsImplants
subject keywordsMetals
subject keywordsSilicides
subject keywordsSilicon
subject keywords14nm
subject keywordsCMOS
subject keywordsContac
identifier doi10.1109/IIT.2014.6939955
journal titlearallel, Distributed and Network-Based Processing (PDP), 2014 22nd Euromicro International Conferenc
filesize460574
citations0
contributor rawauthorGschwandtner, P. , Knobloch, M. , Mohr, B. , Pleiter, D. , Fahringer, T.


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