•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

Author:
Gschwandtner, P. , Knobloch, M. , Mohr, B. , Pleiter, D. , Fahringer, T.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/IIT.2014.6939955
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/984730
Keyword(s): CMOS integrated circuits,annealing,contact resistance,elemental semiconductors,ion implantation,phosphorus,selenium,silicon,titanium compounds,CMOS performance scaling,NMOS contact resistivity reduction,Se,Si:P,TiSi<,sub>,x<,/sub>,damage engineered selenium implant,implant energy optimization,in-situ epitaxially doped n-SD regions,low specific contact resistivity,millisecond laser annealling,Annealing,Contacts,Implants,Metals,Silicides,Silicon,14nm,CMOS,Contac
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

Show full item record

date accessioned2020-03-12T19:38:43Z
date available2020-03-12T19:38:43Z
date issued2014
identifier other6787326.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/984730?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleModeling CPU Energy Consumption of HPC Applications on the IBM POWER7
typeConference Paper
contenttypeMetadata Only
identifier padid8100230
subject keywordsCMOS integrated circuits
subject keywordsannealing
subject keywordscontact resistance
subject keywordselemental semiconductors
subject keywordsion implantation
subject keywordsphosphorus
subject keywordsselenium
subject keywordssilicon
subject keywordstitanium compounds
subject keywordsCMOS performance scaling
subject keywordsNMOS contact resistivity reduction
subject keywordsSe
subject keywordsSi:P
subject keywordsTiSi<
subject keywordssub>
subject keywordsx<
subject keywords/sub>
subject keywordsdamage engineered selenium implant
subject keywordsimplant energy optimization
subject keywordsin-situ epitaxially doped n-SD regions
subject keywordslow specific contact resistivity
subject keywordsmillisecond laser annealling
subject keywordsAnnealing
subject keywordsContacts
subject keywordsImplants
subject keywordsMetals
subject keywordsSilicides
subject keywordsSilicon
subject keywords14nm
subject keywordsCMOS
subject keywordsContac
identifier doi10.1109/IIT.2014.6939955
journal titlearallel, Distributed and Network-Based Processing (PDP), 2014 22nd Euromicro International Conferenc
filesize460574
citations0
contributor rawauthorGschwandtner, P. , Knobloch, M. , Mohr, B. , Pleiter, D. , Fahringer, T.
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace