Highly sensitive seesaw capacitive pressure sensor based on SOI wafer
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سال
: 2014شناسه الکترونیک: 10.1049/el.2013.4170
کلیدواژه(گان): capacitive sensors,deformation,diaphragms,elemental semiconductors,microsensors,pressure sensors,silicon,silicon-on-insulator,MEMS,Si,diaphragm,highly sensitive seesaw capacitive pressure sensor,mechanical deformation,microelectromechanical system,silicon on insulator wafer
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Highly sensitive seesaw capacitive pressure sensor based on SOI wafer
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contributor author | Yang, C.C. | |
contributor author | Zhao, Qiming | |
contributor author | Gao, C.C. | |
contributor author | Liu, G.D. | |
contributor author | Zhang, Y.X. | |
contributor author | Cui, W.P. | |
contributor author | Hao, Y.L. | |
date accessioned | 2020-03-12T23:51:02Z | |
date available | 2020-03-12T23:51:02Z | |
date issued | 2014 | |
identifier issn | 0013-5194 | |
identifier other | 6759700.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1125578 | |
format | general | |
language | English | |
publisher | IET | |
title | Highly sensitive seesaw capacitive pressure sensor based on SOI wafer | |
type | Journal Paper | |
contenttype | Metadata Only | |
identifier padid | 8305249 | |
subject keywords | capacitive sensors | |
subject keywords | deformation | |
subject keywords | diaphragms | |
subject keywords | elemental semiconductors | |
subject keywords | microsensors | |
subject keywords | pressure sensors | |
subject keywords | silicon | |
subject keywords | silicon-on-insulator | |
subject keywords | MEMS | |
subject keywords | Si | |
subject keywords | diaphragm | |
subject keywords | highly sensitive seesaw capacitive pressure sensor | |
subject keywords | mechanical deformation | |
subject keywords | microelectromechanical system | |
subject keywords | silicon on insulator wafer | |
identifier doi | 10.1049/el.2013.4170 | |
journal title | Electronics Letters | |
journal volume | 50 | |
journal issue | 5 | |
filesize | 477714 | |
citations | 0 |