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Highly sensitive seesaw capacitive pressure sensor based on SOI wafer

Author:
Yang, C.C.
,
Zhao, Qiming
,
Gao, C.C.
,
Liu, G.D.
,
Zhang, Y.X.
,
Cui, W.P.
,
Hao, Y.L.
Publisher:
IET
Year
: 2014
DOI: 10.1049/el.2013.4170
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1125578
Keyword(s): capacitive sensors,deformation,diaphragms,elemental semiconductors,microsensors,pressure sensors,silicon,silicon-on-insulator,MEMS,Si,diaphragm,highly sensitive seesaw capacitive pressure sensor,mechanical deformation,microelectromechanical system,silicon on insulator wafer
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    Highly sensitive seesaw capacitive pressure sensor based on SOI wafer

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contributor authorYang, C.C.
contributor authorZhao, Qiming
contributor authorGao, C.C.
contributor authorLiu, G.D.
contributor authorZhang, Y.X.
contributor authorCui, W.P.
contributor authorHao, Y.L.
date accessioned2020-03-12T23:51:02Z
date available2020-03-12T23:51:02Z
date issued2014
identifier issn0013-5194
identifier other6759700.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1125578
formatgeneral
languageEnglish
publisherIET
titleHighly sensitive seesaw capacitive pressure sensor based on SOI wafer
typeJournal Paper
contenttypeMetadata Only
identifier padid8305249
subject keywordscapacitive sensors
subject keywordsdeformation
subject keywordsdiaphragms
subject keywordselemental semiconductors
subject keywordsmicrosensors
subject keywordspressure sensors
subject keywordssilicon
subject keywordssilicon-on-insulator
subject keywordsMEMS
subject keywordsSi
subject keywordsdiaphragm
subject keywordshighly sensitive seesaw capacitive pressure sensor
subject keywordsmechanical deformation
subject keywordsmicroelectromechanical system
subject keywordssilicon on insulator wafer
identifier doi10.1049/el.2013.4170
journal titleElectronics Letters
journal volume50
journal issue5
filesize477714
citations0
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