Highly sensitive seesaw capacitive pressure sensor based on SOI wafer
| contributor author | Yang, C.C. | |
| contributor author | Zhao, Qiming | |
| contributor author | Gao, C.C. | |
| contributor author | Liu, G.D. | |
| contributor author | Zhang, Y.X. | |
| contributor author | Cui, W.P. | |
| contributor author | Hao, Y.L. | |
| date accessioned | 2020-03-12T23:51:02Z | |
| date available | 2020-03-12T23:51:02Z | |
| date issued | 2014 | |
| identifier issn | 0013-5194 | |
| identifier other | 6759700.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1125578?show=full | |
| format | general | |
| language | English | |
| publisher | IET | |
| title | Highly sensitive seesaw capacitive pressure sensor based on SOI wafer | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8305249 | |
| subject keywords | capacitive sensors | |
| subject keywords | deformation | |
| subject keywords | diaphragms | |
| subject keywords | elemental semiconductors | |
| subject keywords | microsensors | |
| subject keywords | pressure sensors | |
| subject keywords | silicon | |
| subject keywords | silicon-on-insulator | |
| subject keywords | MEMS | |
| subject keywords | Si | |
| subject keywords | diaphragm | |
| subject keywords | highly sensitive seesaw capacitive pressure sensor | |
| subject keywords | mechanical deformation | |
| subject keywords | microelectromechanical system | |
| subject keywords | silicon on insulator wafer | |
| identifier doi | 10.1049/el.2013.4170 | |
| journal title | Electronics Letters | |
| journal volume | 50 | |
| journal issue | 5 | |
| filesize | 477714 | |
| citations | 0 |
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