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Alignment technology for coil movement of Joule Balance

date accessioned2020-03-12T23:33:18Z
date available2020-03-12T23:33:18Z
date issued2014
identifier other6898547.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115855?show=full
formatgeneral
languageEnglish
publisherIEEE
titleAlignment technology for coil movement of Joule Balance
typeConference Paper
contenttypeMetadata Only
identifier padid8285362
subject keywordselectromigration
subject keywordsintegrated circuit modelling
subject keywordsintegrated circuit reliability
subject keywordsthree-dimensional integrated circuits
subject keywordsTSV
subject keywordselectrical parameters
subject keywordselectromigration-induced stress
subject keywordsreliability
subject keywordsthermo-mechanical stress distribution
subject keywordsthree-dimensional simulations
subject keywordsthrough-silicon vias
subject keywordstwo-dimensional simulations
subject keywordsAnalytical models
subject keywordsCurrent density
subject keywordsMaterials
subject keywordsSolid modeling
subject keywordsStress
subject keywordsThree-dimensional displays
subject keywordsThrough-silicon vias
identifier doi10.1109/SISPAD.2014.6931633
journal titlerecision Electromagnetic Measurements (CPEM 2014), 2014 Conference on
filesize319905
citations0
contributor rawauthorZeng, Tao , Lu, Yunfeng , Yang, Hongxing , Hu, Pengcheng , Zhang, Zhonghua


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