Alignment technology for coil movement of Joule Balance
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Year
: 2014DOI: 10.1109/SISPAD.2014.6931633
Keyword(s): electromigration,integrated circuit modelling,integrated circuit reliability,three-dimensional integrated circuits,TSV,electrical parameters,electromigration-induced stress,reliability,thermo-mechanical stress distribution,three-dimensional simulations,through-silicon vias,two-dimensional simulations,Analytical models,Current density,Materials,Solid modeling,Stress,Three-dimensional displays,Through-silicon vias
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Alignment technology for coil movement of Joule Balance
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| date accessioned | 2020-03-12T23:33:18Z | |
| date available | 2020-03-12T23:33:18Z | |
| date issued | 2014 | |
| identifier other | 6898547.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115855?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Alignment technology for coil movement of Joule Balance | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8285362 | |
| subject keywords | electromigration | |
| subject keywords | integrated circuit modelling | |
| subject keywords | integrated circuit reliability | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | TSV | |
| subject keywords | electrical parameters | |
| subject keywords | electromigration-induced stress | |
| subject keywords | reliability | |
| subject keywords | thermo-mechanical stress distribution | |
| subject keywords | three-dimensional simulations | |
| subject keywords | through-silicon vias | |
| subject keywords | two-dimensional simulations | |
| subject keywords | Analytical models | |
| subject keywords | Current density | |
| subject keywords | Materials | |
| subject keywords | Solid modeling | |
| subject keywords | Stress | |
| subject keywords | Three-dimensional displays | |
| subject keywords | Through-silicon vias | |
| identifier doi | 10.1109/SISPAD.2014.6931633 | |
| journal title | recision Electromagnetic Measurements (CPEM 2014), 2014 Conference on | |
| filesize | 319905 | |
| citations | 0 | |
| contributor rawauthor | Zeng, Tao , Lu, Yunfeng , Yang, Hongxing , Hu, Pengcheng , Zhang, Zhonghua |