Show simple item record

Development of exposed die large body to die size ratio wafer level package technology

date accessioned2020-03-12T23:32:16Z
date available2020-03-12T23:32:16Z
date issued2014
identifier other6897403.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115220?show=full
formatgeneral
languageEnglish
publisherIEEE
titleDevelopment of exposed die large body to die size ratio wafer level package technology
typeConference Paper
contenttypeMetadata Only
identifier padid8284635
subject keywordsaluminium alloys
subject keywordsmetallisation
subject keywordsnumerical analysis
subject keywordssolar cells
subject keywordsvoids (solid)
subject keywords2D numerical device simulations
subject keywords60-cell-based module
subject keywordsaluminium-alloyed local contacts
subject keywordsfiring process
subject keywordsformation mechanism
subject keywordsindustrial PERC cells
subject keywordsindustrial firing process
subject keywordslateral diffusion
subject keywordslocal contacts
subject keywordslocal printing
subject keywordslow temperature firing
subject keywordstwo-step metallization
subject keywordsvoids
subject keywordsvoltage 666 mV
subject keywordsFiring
subject keywordsMetallization
subject keywordsNumerical models
subject keywordsPassivation
subject keywordsPhotovoltaic cells
subject keywordsPrinting
subject keywordsSilicon
subject keywordsPERC cell
subject keywordsmetallization
subject keywordssc
identifier doi10.1109/PVSC.2014.6925645
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize1879181
citations0
contributor rawauthorOsenbach, J. , Emerich, S. , Golick, L. , Cate, S. , Chan, M. , Yoon, S.W. , Lin, Y.J. , Wong, K.


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record