Development of exposed die large body to die size ratio wafer level package technology
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: 2014DOI: 10.1109/PVSC.2014.6925645
Keyword(s): aluminium alloys,metallisation,numerical analysis,solar cells,voids (solid),2D numerical device simulations,60-cell-based module,aluminium-alloyed local contacts,firing process,formation mechanism,industrial PERC cells,industrial firing process,lateral diffusion,local contacts,local printing,low temperature firing,two-step metallization,voids,voltage 666 mV,Firing,Metallization,Numerical models,Passivation,Photovoltaic cells,Printing,Silicon,PERC cell,metallization,sc
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Development of exposed die large body to die size ratio wafer level package technology
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| date accessioned | 2020-03-12T23:32:16Z | |
| date available | 2020-03-12T23:32:16Z | |
| date issued | 2014 | |
| identifier other | 6897403.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115220?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Development of exposed die large body to die size ratio wafer level package technology | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284635 | |
| subject keywords | aluminium alloys | |
| subject keywords | metallisation | |
| subject keywords | numerical analysis | |
| subject keywords | solar cells | |
| subject keywords | voids (solid) | |
| subject keywords | 2D numerical device simulations | |
| subject keywords | 60-cell-based module | |
| subject keywords | aluminium-alloyed local contacts | |
| subject keywords | firing process | |
| subject keywords | formation mechanism | |
| subject keywords | industrial PERC cells | |
| subject keywords | industrial firing process | |
| subject keywords | lateral diffusion | |
| subject keywords | local contacts | |
| subject keywords | local printing | |
| subject keywords | low temperature firing | |
| subject keywords | two-step metallization | |
| subject keywords | voids | |
| subject keywords | voltage 666 mV | |
| subject keywords | Firing | |
| subject keywords | Metallization | |
| subject keywords | Numerical models | |
| subject keywords | Passivation | |
| subject keywords | Photovoltaic cells | |
| subject keywords | Printing | |
| subject keywords | Silicon | |
| subject keywords | PERC cell | |
| subject keywords | metallization | |
| subject keywords | sc | |
| identifier doi | 10.1109/PVSC.2014.6925645 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 1879181 | |
| citations | 0 | |
| contributor rawauthor | Osenbach, J. , Emerich, S. , Golick, L. , Cate, S. , Chan, M. , Yoon, S.W. , Lin, Y.J. , Wong, K. |