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contributor authorMorales, A.
contributor authorVillapol, M.E.
contributor authorContreras, L.
date accessioned2020-03-12T21:54:52Z
date available2020-03-12T21:54:52Z
date issued2014
identifier other6965138.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1064929?show=full
formatgeneral
languageEnglish
publisherIEEE
titleImproving the specification of the WiMax ARQ operation
typeConference Paper
contenttypeMetadata Only
identifier padid8198125
subject keywordselectrical resistivity
subject keywordsn metallic thin films
subject keywordsn nickel
subject keywordsn plasma CVD
subject keywordsn H<
subject keywordssub>
subject keywords2<
subject keywords/sub>
subject keywords-NH<
subject keywordssub>
subject keywords3<
subject keywords/sub>
subject keywordsreducing agent
subject keywordsn Ni
subject keywordsn Ni metal film
subject keywordsn Ni(allyl)(PCAI-iPr)
subject keywordsn PEALD evaluation
subject keywordsn [Ni(allyl)(PCAI-R)]
subject keywordsn alkyl-pyrrolylimine ligands
subject keywordsn allyl-pyrrolylimine ligands
subject keywordsn fluorine free nickel precursors
subject keywordsn oxygen free nickel precursors
subject keywordsn plasma enhanced ALD
subject keywordsn resistivity
subject keywordsn resistivity 5 muohmcm to 10 muohmcm
subject keywordsn temperature 400 degC
identifier doi10.1109/IITC.2014.6831859
journal titleomputing Conference (CLEI), 2014 XL Latin American
filesize556076
citations0


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