Improving the specification of the WiMax ARQ operation
Publisher:
Year
: 2014DOI: 10.1109/IITC.2014.6831859
Keyword(s): electrical resistivity,n metallic thin films,n nickel,n plasma CVD,n H<,sub>,2<,/sub>,-NH<,sub>,3<,/sub>,reducing agent,n Ni,n Ni metal film,n Ni(allyl)(PCAI-iPr),n PEALD evaluation,n [Ni(allyl)(PCAI-R)],n alkyl-pyrrolylimine ligands,n allyl-pyrrolylimine ligands,n fluorine free nickel precursors,n oxygen free nickel precursors,n plasma enhanced ALD,n resistivity,n resistivity 5 muohmcm to 10 muohmcm,n temperature 400 degC
Collections
:
-
Statistics
Improving the specification of the WiMax ARQ operation
Show full item record
| contributor author | Morales, A. | |
| contributor author | Villapol, M.E. | |
| contributor author | Contreras, L. | |
| date accessioned | 2020-03-12T21:54:52Z | |
| date available | 2020-03-12T21:54:52Z | |
| date issued | 2014 | |
| identifier other | 6965138.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1064929 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Improving the specification of the WiMax ARQ operation | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8198125 | |
| subject keywords | electrical resistivity | |
| subject keywords | n metallic thin films | |
| subject keywords | n nickel | |
| subject keywords | n plasma CVD | |
| subject keywords | n H< | |
| subject keywords | sub> | |
| subject keywords | 2< | |
| subject keywords | /sub> | |
| subject keywords | -NH< | |
| subject keywords | sub> | |
| subject keywords | 3< | |
| subject keywords | /sub> | |
| subject keywords | reducing agent | |
| subject keywords | n Ni | |
| subject keywords | n Ni metal film | |
| subject keywords | n Ni(allyl)(PCAI-iPr) | |
| subject keywords | n PEALD evaluation | |
| subject keywords | n [Ni(allyl)(PCAI-R)] | |
| subject keywords | n alkyl-pyrrolylimine ligands | |
| subject keywords | n allyl-pyrrolylimine ligands | |
| subject keywords | n fluorine free nickel precursors | |
| subject keywords | n oxygen free nickel precursors | |
| subject keywords | n plasma enhanced ALD | |
| subject keywords | n resistivity | |
| subject keywords | n resistivity 5 muohmcm to 10 muohmcm | |
| subject keywords | n temperature 400 degC | |
| identifier doi | 10.1109/IITC.2014.6831859 | |
| journal title | omputing Conference (CLEI), 2014 XL Latin American | |
| filesize | 556076 | |
| citations | 0 |