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Technological dynamics: An empirical study in mobile telecommunications

contributor authorMei, Hsiao-Chen , Lo, Shihmin , Sher, Peter J.
date accessioned2020-03-12T21:01:16Z
date available2020-03-12T21:01:16Z
date issued2014
identifier other6921054.pdf
identifier urihttp://libsearch.um.ac.ir:80/fum/handle/fum/1034166?show=full
formatgeneral
languageEnglish
publisherIEEE
titleTechnological dynamics: An empirical study in mobile telecommunications
typeConference Paper
contenttypeMetadata Only
identifier padid8160010
subject keywordsdelays
subject keywordsfault tolerance
subject keywordsintegrated circuit manufacture
subject keywordsnetwork routing
subject keywordsnetwork-on-chip
subject keywordsthree-dimensional integrated circuits
subject keywords3D manufacture variability
subject keywords3D network-on-chip
subject keywordsTSV propagation delays
subject keywordsadaptive routing
subject keywordsasynchronous communication interfaces
subject keywordsdelay distribution
subject keywordsopen defective TSV
subject keywordspartially connected 3D NoC
subject keywordsresistive defective TSV
subject keywordsserial communication
subject keywordsthrough silicon vias
subject keywordsClocks
subject keywordsDelays
subject keywordsElevators
subject keywordsRouting
subject keywordsTelecommunication traffic
subject keywordsThree-dimensional displays
subject keywordsThrough-silic
identifier doi10.1109/NEWCAS.2014.6933985
journal titleanagement of Engineering & Technology (PICMET), 2014 Portland International Conference on
filesize341550
citations0


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