Technological dynamics: An empirical study in mobile telecommunications
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Year
: 2014DOI: 10.1109/NEWCAS.2014.6933985
Keyword(s): delays,fault tolerance,integrated circuit manufacture,network routing,network-on-chip,three-dimensional integrated circuits,3D manufacture variability,3D network-on-chip,TSV propagation delays,adaptive routing,asynchronous communication interfaces,delay distribution,open defective TSV,partially connected 3D NoC,resistive defective TSV,serial communication,through silicon vias,Clocks,Delays,Elevators,Routing,Telecommunication traffic,Three-dimensional displays,Through-silic
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Technological dynamics: An empirical study in mobile telecommunications
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| contributor author | Mei, Hsiao-Chen , Lo, Shihmin , Sher, Peter J. | |
| date accessioned | 2020-03-12T21:01:16Z | |
| date available | 2020-03-12T21:01:16Z | |
| date issued | 2014 | |
| identifier other | 6921054.pdf | |
| identifier uri | http://libsearch.um.ac.ir:80/fum/handle/fum/1034166?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Technological dynamics: An empirical study in mobile telecommunications | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8160010 | |
| subject keywords | delays | |
| subject keywords | fault tolerance | |
| subject keywords | integrated circuit manufacture | |
| subject keywords | network routing | |
| subject keywords | network-on-chip | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | 3D manufacture variability | |
| subject keywords | 3D network-on-chip | |
| subject keywords | TSV propagation delays | |
| subject keywords | adaptive routing | |
| subject keywords | asynchronous communication interfaces | |
| subject keywords | delay distribution | |
| subject keywords | open defective TSV | |
| subject keywords | partially connected 3D NoC | |
| subject keywords | resistive defective TSV | |
| subject keywords | serial communication | |
| subject keywords | through silicon vias | |
| subject keywords | Clocks | |
| subject keywords | Delays | |
| subject keywords | Elevators | |
| subject keywords | Routing | |
| subject keywords | Telecommunication traffic | |
| subject keywords | Three-dimensional displays | |
| subject keywords | Through-silic | |
| identifier doi | 10.1109/NEWCAS.2014.6933985 | |
| journal title | anagement of Engineering & Technology (PICMET), 2014 Portland International Conference on | |
| filesize | 341550 | |
| citations | 0 |