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contributor authorShudong Lin , Roberts, G.W.
date accessioned2020-03-12T20:02:28Z
date available2020-03-12T20:02:28Z
date issued2014
identifier other6847832.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/999570?show=full
formatgeneral
languageEnglish
publisherIEEE
titleTowards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC
typeConference Paper
contenttypeMetadata Only
identifier padid8119947
subject keywordsAccuracy
subject keywordsConvergence
subject keywordsEstimation
subject keywordsLeast squares approximations
subject keywordsMeasurement
subject keywordsRobustness
subject keywordsTopology
identifier doi10.1109/VTCSpring.2014.7022883
journal titleest Symposium (ETS), 2014 19th IEEE European
filesize1109715
citations0


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