Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC
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: 2014شناسه الکترونیک: 10.1109/VTCSpring.2014.7022883
کلیدواژه(گان): Accuracy,Convergence,Estimation,Least squares approximations,Measurement,Robustness,Topology
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Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC
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| contributor author | Shudong Lin , Roberts, G.W. | |
| date accessioned | 2020-03-12T20:02:28Z | |
| date available | 2020-03-12T20:02:28Z | |
| date issued | 2014 | |
| identifier other | 6847832.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/999570?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8119947 | |
| subject keywords | Accuracy | |
| subject keywords | Convergence | |
| subject keywords | Estimation | |
| subject keywords | Least squares approximations | |
| subject keywords | Measurement | |
| subject keywords | Robustness | |
| subject keywords | Topology | |
| identifier doi | 10.1109/VTCSpring.2014.7022883 | |
| journal title | est Symposium (ETS), 2014 19th IEEE European | |
| filesize | 1109715 | |
| citations | 0 |