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FDFD Modeling of Signal Paths With TSVs in Silicon Interposer

contributor authorBiancun Xie
contributor authorSwaminathan, Madhavan
date accessioned2020-03-12T18:43:16Z
date available2020-03-12T18:43:16Z
date issued2014
identifier issn2156-3950
identifier other6727465.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/968084?show=full
formatgeneral
languageEnglish
publisherIEEE
titleFDFD Modeling of Signal Paths With TSVs in Silicon Interposer
typeJournal Paper
contenttypeMetadata Only
identifier padid8002150
subject keywordsdivide and conquer methods
subject keywordselemental semiconductors
subject keywordsfinite difference methods
subject keywordsfrequency-domain analysis
subject keywordsintegral equations
subject keywordsintegrated circuit interconnections
subject keywordssilicon
subject keywordsthree-dimensional integrated circuits
subject keywordstransmission lines
subject keywords3D FDFD method
subject keywords3D finite-difference frequency-domain
subject keywords3D full-wave simulations
subject keywordsSi
subject keywordsTSV
subject keywordscylindrical modal basis functions
subject keywordsdivide-and-conquer approach
subject keywordsintegral equation
subject keywordslossy silicon interposer
subject keywordsmultiple transmission lines
subject keywordsmultiport network
subject keywordsparasitic effects
subject keywordss
identifier doi10.1109/TCPMT.2013.2297154
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue4
filesize2082464
citations0


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