FDFD Modeling of Signal Paths With TSVs in Silicon Interposer
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Year
: 2014DOI: 10.1109/TCPMT.2013.2297154
Keyword(s): divide and conquer methods,elemental semiconductors,finite difference methods,frequency-domain analysis,integral equations,integrated circuit interconnections,silicon,three-dimensional integrated circuits,transmission lines,3D FDFD method,3D finite-difference frequency-domain,3D full-wave simulations,Si,TSV,cylindrical modal basis functions,divide-and-conquer approach,integral equation,lossy silicon interposer,multiple transmission lines,multiport network,parasitic effects,s
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FDFD Modeling of Signal Paths With TSVs in Silicon Interposer
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| contributor author | Biancun Xie | |
| contributor author | Swaminathan, Madhavan | |
| date accessioned | 2020-03-12T18:43:16Z | |
| date available | 2020-03-12T18:43:16Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6727465.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/968084?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | FDFD Modeling of Signal Paths With TSVs in Silicon Interposer | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8002150 | |
| subject keywords | divide and conquer methods | |
| subject keywords | elemental semiconductors | |
| subject keywords | finite difference methods | |
| subject keywords | frequency-domain analysis | |
| subject keywords | integral equations | |
| subject keywords | integrated circuit interconnections | |
| subject keywords | silicon | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | transmission lines | |
| subject keywords | 3D FDFD method | |
| subject keywords | 3D finite-difference frequency-domain | |
| subject keywords | 3D full-wave simulations | |
| subject keywords | Si | |
| subject keywords | TSV | |
| subject keywords | cylindrical modal basis functions | |
| subject keywords | divide-and-conquer approach | |
| subject keywords | integral equation | |
| subject keywords | lossy silicon interposer | |
| subject keywords | multiple transmission lines | |
| subject keywords | multiport network | |
| subject keywords | parasitic effects | |
| subject keywords | s | |
| identifier doi | 10.1109/TCPMT.2013.2297154 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 4 | |
| filesize | 2082464 | |
| citations | 0 |