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Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring

contributor authorYingzhe Hu
contributor authorRieutort-Louis, Warren S. /A/.
contributor authorSanz-Robinson, Josue
contributor authorLiechao Huang
contributor authorGlisic, Branko
contributor authorSturm, James C.
contributor authorWagner, Steffen
contributor authorVerma, Naveen
date accessioned2020-03-12T18:40:03Z
date available2020-03-12T18:40:03Z
date issued2014
identifier issn0018-9200
identifier other6709767.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/966179?show=full
formatgeneral
languageEnglish
publisherIEEE
titleLarge-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring
typeJournal Paper
contenttypeMetadata Only
identifier padid7999955
subject keywordsCMOS integrated circuits
subject keywordscondition monitoring
subject keywordsdistributed sensors
subject keywordsintegrated circuit interconnections
subject keywordsintegrated circuit packaging
subject keywordsstrain gauges
subject keywordsstrain sensors
subject keywordsstructural engineering
subject keywordsthin film transistors
subject keywordsCMOS IC
subject keywordsIC packages
subject keywordscapacitive antennas
subject keywordscentimeter-scale resolution
subject keywordsdamage detection
subject keywordsdata aggregation
subject keywordsdistance 7.5 m
subject keywordsdistributed sheet
subject keywordsinductive antennas
subject keywordsinterconnects
subject keywordslarge-area electronics
subject keywordslarge-scale sensing system
subject keywordsmany-channel distributed sensing
subject keywordsmetallurgical bonds
subject keywordsm
identifier doi10.1109/JSSC.2013.2295979
journal titleSolid-State Circuits, IEEE Journal of
journal volume49
journal issue2
filesize2569644
citations0


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