Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring
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: 2014DOI: 10.1109/JSSC.2013.2295979
Keyword(s): CMOS integrated circuits,condition monitoring,distributed sensors,integrated circuit interconnections,integrated circuit packaging,strain gauges,strain sensors,structural engineering,thin film transistors,CMOS IC,IC packages,capacitive antennas,centimeter-scale resolution,damage detection,data aggregation,distance 7.5 m,distributed sheet,inductive antennas,interconnects,large-area electronics,large-scale sensing system,many-channel distributed sensing,metallurgical bonds,m
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Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring
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| contributor author | Yingzhe Hu | |
| contributor author | Rieutort-Louis, Warren S. /A/. | |
| contributor author | Sanz-Robinson, Josue | |
| contributor author | Liechao Huang | |
| contributor author | Glisic, Branko | |
| contributor author | Sturm, James C. | |
| contributor author | Wagner, Steffen | |
| contributor author | Verma, Naveen | |
| date accessioned | 2020-03-12T18:40:03Z | |
| date available | 2020-03-12T18:40:03Z | |
| date issued | 2014 | |
| identifier issn | 0018-9200 | |
| identifier other | 6709767.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/966179?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Large-Scale Sensing System Combining Large-Area Electronics and CMOS ICs for Structural-Health Monitoring | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7999955 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | condition monitoring | |
| subject keywords | distributed sensors | |
| subject keywords | integrated circuit interconnections | |
| subject keywords | integrated circuit packaging | |
| subject keywords | strain gauges | |
| subject keywords | strain sensors | |
| subject keywords | structural engineering | |
| subject keywords | thin film transistors | |
| subject keywords | CMOS IC | |
| subject keywords | IC packages | |
| subject keywords | capacitive antennas | |
| subject keywords | centimeter-scale resolution | |
| subject keywords | damage detection | |
| subject keywords | data aggregation | |
| subject keywords | distance 7.5 m | |
| subject keywords | distributed sheet | |
| subject keywords | inductive antennas | |
| subject keywords | interconnects | |
| subject keywords | large-area electronics | |
| subject keywords | large-scale sensing system | |
| subject keywords | many-channel distributed sensing | |
| subject keywords | metallurgical bonds | |
| subject keywords | m | |
| identifier doi | 10.1109/JSSC.2013.2295979 | |
| journal title | Solid-State Circuits, IEEE Journal of | |
| journal volume | 49 | |
| journal issue | 2 | |
| filesize | 2569644 | |
| citations | 0 |