Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
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: 2014DOI: 10.1109/TCPMT.2013.2284580
Keyword(s): copper,electroplating,integrated circuit manufacture,integrated circuit testing,metallisation,polymers,silicon,thermal stability,three-dimensional integrated circuits,wafer level packaging,3D heterogeneous integration applications,3D interposer test vehicle,Cu,Si,TSV-enabled silicon interposer fabrication,TSV-enabled silicon interposer testing,TSVs,backside metal layer,copper-filled through-silicon vias,daisy chains,electrically functional freestanding silicon interposer,ele
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Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
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| contributor author | Lannon, J. | |
| contributor author | Hilton, Adrian | |
| contributor author | Huffman, Alan | |
| contributor author | Butler, Mairead | |
| contributor author | Malta, D. | |
| contributor author | Gregory, Chris | |
| contributor author | Temple, D. | |
| date accessioned | 2020-03-12T18:33:09Z | |
| date available | 2020-03-12T18:33:09Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6665122.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/962278?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7995244 | |
| subject keywords | copper | |
| subject keywords | electroplating | |
| subject keywords | integrated circuit manufacture | |
| subject keywords | integrated circuit testing | |
| subject keywords | metallisation | |
| subject keywords | polymers | |
| subject keywords | silicon | |
| subject keywords | thermal stability | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | wafer level packaging | |
| subject keywords | 3D heterogeneous integration applications | |
| subject keywords | 3D interposer test vehicle | |
| subject keywords | Cu | |
| subject keywords | Si | |
| subject keywords | TSV-enabled silicon interposer fabrication | |
| subject keywords | TSV-enabled silicon interposer testing | |
| subject keywords | TSVs | |
| subject keywords | backside metal layer | |
| subject keywords | copper-filled through-silicon vias | |
| subject keywords | daisy chains | |
| subject keywords | electrically functional freestanding silicon interposer | |
| subject keywords | ele | |
| identifier doi | 10.1109/TCPMT.2013.2284580 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 1 | |
| filesize | 1286643 | |
| citations | 0 |