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Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

contributor authorLannon, J.
contributor authorHilton, Adrian
contributor authorHuffman, Alan
contributor authorButler, Mairead
contributor authorMalta, D.
contributor authorGregory, Chris
contributor authorTemple, D.
date accessioned2020-03-12T18:33:09Z
date available2020-03-12T18:33:09Z
date issued2014
identifier issn2156-3950
identifier other6665122.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/962278?show=full
formatgeneral
languageEnglish
publisherIEEE
titleFabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
typeJournal Paper
contenttypeMetadata Only
identifier padid7995244
subject keywordscopper
subject keywordselectroplating
subject keywordsintegrated circuit manufacture
subject keywordsintegrated circuit testing
subject keywordsmetallisation
subject keywordspolymers
subject keywordssilicon
subject keywordsthermal stability
subject keywordsthree-dimensional integrated circuits
subject keywordswafer level packaging
subject keywords3D heterogeneous integration applications
subject keywords3D interposer test vehicle
subject keywordsCu
subject keywordsSi
subject keywordsTSV-enabled silicon interposer fabrication
subject keywordsTSV-enabled silicon interposer testing
subject keywordsTSVs
subject keywordsbackside metal layer
subject keywordscopper-filled through-silicon vias
subject keywordsdaisy chains
subject keywordselectrically functional freestanding silicon interposer
subject keywordsele
identifier doi10.1109/TCPMT.2013.2284580
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue1
filesize1286643
citations0


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