Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis
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: 2014شناسه الکترونیک: 10.1109/TSM.2013.2287492
کلیدواژه(گان): electrophoresis,electroplating,integrated circuit manufacture,organic compounds,process control,recycling,semiconductor device manufacture,standards,Au,Cu,PDC,capillary electrophoresis,copper ions,copper plating,gold plating,inorganic ions,microelectronic manufacturing process,plating solutions,process control,production cost,production efficiency,pyridine dicarboxylic acid,recycling,relative standard deviations,semiconductor manufacturing process,sulfate matrix,tris bu
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Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis
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contributor author | Chang, J.W. | |
contributor author | Sung, Y.I. | |
contributor author | Lim, H.B. | |
date accessioned | 2020-03-12T18:31:03Z | |
date available | 2020-03-12T18:31:03Z | |
date issued | 2014 | |
identifier issn | 0894-6507 | |
identifier other | 6648445.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/961145 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis | |
type | Journal Paper | |
contenttype | Metadata Only | |
identifier padid | 7993892 | |
subject keywords | electrophoresis | |
subject keywords | electroplating | |
subject keywords | integrated circuit manufacture | |
subject keywords | organic compounds | |
subject keywords | process control | |
subject keywords | recycling | |
subject keywords | semiconductor device manufacture | |
subject keywords | standards | |
subject keywords | Au | |
subject keywords | Cu | |
subject keywords | PDC | |
subject keywords | capillary electrophoresis | |
subject keywords | copper ions | |
subject keywords | copper plating | |
subject keywords | gold plating | |
subject keywords | inorganic ions | |
subject keywords | microelectronic manufacturing process | |
subject keywords | plating solutions | |
subject keywords | process control | |
subject keywords | production cost | |
subject keywords | production efficiency | |
subject keywords | pyridine dicarboxylic acid | |
subject keywords | recycling | |
subject keywords | relative standard deviations | |
subject keywords | semiconductor manufacturing process | |
subject keywords | sulfate matrix | |
subject keywords | tris bu | |
identifier doi | 10.1109/TSM.2013.2287492 | |
journal title | Semiconductor Manufacturing, IEEE Transactions on | |
journal volume | 27 | |
journal issue | 1 | |
filesize | 245203 | |
citations | 0 |