Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis
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Year
: 2014DOI: 10.1109/TSM.2013.2287492
Keyword(s): electrophoresis,electroplating,integrated circuit manufacture,organic compounds,process control,recycling,semiconductor device manufacture,standards,Au,Cu,PDC,capillary electrophoresis,copper ions,copper plating,gold plating,inorganic ions,microelectronic manufacturing process,plating solutions,process control,production cost,production efficiency,pyridine dicarboxylic acid,recycling,relative standard deviations,semiconductor manufacturing process,sulfate matrix,tris bu
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Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis
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| contributor author | Chang, J.W. | |
| contributor author | Sung, Y.I. | |
| contributor author | Lim, H.B. | |
| date accessioned | 2020-03-12T18:31:03Z | |
| date available | 2020-03-12T18:31:03Z | |
| date issued | 2014 | |
| identifier issn | 0894-6507 | |
| identifier other | 6648445.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/961145?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7993892 | |
| subject keywords | electrophoresis | |
| subject keywords | electroplating | |
| subject keywords | integrated circuit manufacture | |
| subject keywords | organic compounds | |
| subject keywords | process control | |
| subject keywords | recycling | |
| subject keywords | semiconductor device manufacture | |
| subject keywords | standards | |
| subject keywords | Au | |
| subject keywords | Cu | |
| subject keywords | PDC | |
| subject keywords | capillary electrophoresis | |
| subject keywords | copper ions | |
| subject keywords | copper plating | |
| subject keywords | gold plating | |
| subject keywords | inorganic ions | |
| subject keywords | microelectronic manufacturing process | |
| subject keywords | plating solutions | |
| subject keywords | process control | |
| subject keywords | production cost | |
| subject keywords | production efficiency | |
| subject keywords | pyridine dicarboxylic acid | |
| subject keywords | recycling | |
| subject keywords | relative standard deviations | |
| subject keywords | semiconductor manufacturing process | |
| subject keywords | sulfate matrix | |
| subject keywords | tris bu | |
| identifier doi | 10.1109/TSM.2013.2287492 | |
| journal title | Semiconductor Manufacturing, IEEE Transactions on | |
| journal volume | 27 | |
| journal issue | 1 | |
| filesize | 245203 | |
| citations | 0 |