date accessioned | 2020-03-12T11:00:21Z | |
date available | 2020-03-12T11:00:21Z | |
date issued | 2014 | |
identifier issn | 1005-0302 | |
identifier other | 10.1016-j.jmst.2014.06.009.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/843492?show=full | |
format | general | |
language | English | |
publisher | Allerton Press Inc | |
title | Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints | |
type | Journal Paper | |
contenttype | Metadata Only | |
identifier padid | 6669933 | |
subject keywords | Fe–Ni alloy | |
subject keywords | Under bump metallization (UBM) | |
subject keywords | Intermetallic compound (IMC) | |
subject keywords | Reliability | |
subject keywords | High temperature storage | |
subject keywords | Temperature cycling | |
identifier doi | 10.1016/j.jmst.2014.06.009 | |
journal title | Journal of Materials Science & Technology | |
journal volume | 30 | |
journal issue | 9 | |
filesize | 1527578 | |
citations | 0 | |
contributor rawauthor | Zhang, Hao - Zhu, Qing - Liu, Zhi - Zhang, Li - Guo, Hongyan - Lai, Chi | |