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date accessioned2020-03-12T11:00:21Z
date available2020-03-12T11:00:21Z
date issued2014
identifier issn1005-0302
identifier other10.1016-j.jmst.2014.06.009.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/843492?show=full
formatgeneral
languageEnglish
publisherAllerton Press Inc
titleEffect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
typeJournal Paper
contenttypeMetadata Only
identifier padid6669933
subject keywordsFe–Ni alloy
subject keywordsUnder bump metallization (UBM)
subject keywordsIntermetallic compound (IMC)
subject keywordsReliability
subject keywordsHigh temperature storage
subject keywordsTemperature cycling
identifier doi10.1016/j.jmst.2014.06.009
journal titleJournal of Materials Science & Technology
journal volume30
journal issue9
filesize1527578
citations0
contributor rawauthorZhang, Hao - Zhu, Qing - Liu, Zhi - Zhang, Li - Guo, Hongyan - Lai, Chi


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