Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
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Year
: 2014DOI: 10.1016/j.jmst.2014.06.009
Keyword(s): Fe–Ni alloy,Under bump metallization (UBM),Intermetallic compound (IMC),Reliability,High temperature storage,Temperature cycling
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Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints
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| date accessioned | 2020-03-12T11:00:21Z | |
| date available | 2020-03-12T11:00:21Z | |
| date issued | 2014 | |
| identifier issn | 1005-0302 | |
| identifier other | 10.1016-j.jmst.2014.06.009.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/843492?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | Allerton Press Inc | |
| title | Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe–Ni Solder Joints | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 6669933 | |
| subject keywords | Fe–Ni alloy | |
| subject keywords | Under bump metallization (UBM) | |
| subject keywords | Intermetallic compound (IMC) | |
| subject keywords | Reliability | |
| subject keywords | High temperature storage | |
| subject keywords | Temperature cycling | |
| identifier doi | 10.1016/j.jmst.2014.06.009 | |
| journal title | Journal of Materials Science & Technology | |
| journal volume | 30 | |
| journal issue | 9 | |
| filesize | 1527578 | |
| citations | 0 | |
| contributor rawauthor | Zhang, Hao - Zhu, Qing - Liu, Zhi - Zhang, Li - Guo, Hongyan - Lai, Chi |