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Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

contributor authorZhenzhen Shen
contributor authorKun Fang
contributor authorJohnson, R. Wayne
contributor authorHamilton, Michael C.
date accessioned2020-03-13T00:21:02Z
date available2020-03-13T00:21:02Z
date issued2014
identifier issn2156-3950
identifier other6891308.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1143450?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCharacterization of Bi–Ag–X Solder for High Temperature SiC Die Attach
typeJournal Paper
contenttypeMetadata Only
identifier padid8326069
subject keywordsageing
subject keywordsbismuth alloys
subject keywordsmelting point
subject keywordsmicroassembling
subject keywordsnickel alloys
subject keywordspower semiconductor devices
subject keywordsshear strength
subject keywordssilicon compounds
subject keywordssilver alloys
subject keywordssolders
subject keywordsthermal management (packaging)
subject keywordswide band gap semiconductors
subject keywordsBi-Ag-X solder paste
subject keywordsCuMo surfaces
subject keywordsDBC
subject keywordsNiBi<
subject keywordssub>
subject keywords3<
subject keywords/sub>
subject keywordsSiC
subject keywordsSiC power devices
subject keywordsaging
subject keywordsdie shear strength
subject keywordsdirect bond copper
subject keywordshigh temperature SiC die attach
subject keywordshigh-temperature storage
subject keywordshybrid electric vehicle
subject keywordsintermetallic formation
subject keywordslead-free solders
subject keywordsmelting
identifier doi10.1109/TCPMT.2014.2345500
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue11
filesize5414559
citations0


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