•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

The Role of Ti Capping Layer in HfO<sub><italic>x</italic></sub>-Based RRAM Devices

Author:
Zheng Fang
,
Xin Peng Wang
,
Joon Sohn
,
Bao Bin Weng
,
Zhi Ping Zhang
,
Zhi Xian Chen
,
Yan Zhe Tang
,
Guo-Qiang Lo
,
Provine, J.
,
Wong, S. Simon
,
Wong, H.-S Philip
,
Dim-Lee Kwong
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/LED.2014.2334311
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1139075
Keyword(s): hafnium compounds,random-access storage,titanium,HfO<,sub>,x<,/sub>,RRAM devices,Ti,capping layer,memory performance,oxygen reservoir,resistive random access memory device,resistive switching,size 10 nm,size 8 nm,Electrodes,Electron devices,Hafnium compounds,Performance evaluation,Resistance,Switches,Nonvolatile memory,Ti capping,Ti capping.,resistive random access memory (RRAM),resistive switching (RS)
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    The Role of Ti Capping Layer in HfO&lt;sub&gt;&lt;italic&gt;x&lt;/italic&gt;&lt;/sub&gt;-Based RRAM Devices

Show full item record

contributor authorZheng Fang
contributor authorXin Peng Wang
contributor authorJoon Sohn
contributor authorBao Bin Weng
contributor authorZhi Ping Zhang
contributor authorZhi Xian Chen
contributor authorYan Zhe Tang
contributor authorGuo-Qiang Lo
contributor authorProvine, J.
contributor authorWong, S. Simon
contributor authorWong, H.-S Philip
contributor authorDim-Lee Kwong
date accessioned2020-03-13T00:13:54Z
date available2020-03-13T00:13:54Z
date issued2014
identifier issn0741-3106
identifier other6856165.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1139075
formatgeneral
languageEnglish
publisherIEEE
titleThe Role of Ti Capping Layer in HfO<sub><italic>x</italic></sub>-Based RRAM Devices
typeJournal Paper
contenttypeMetadata Only
identifier padid8321259
subject keywordshafnium compounds
subject keywordsrandom-access storage
subject keywordstitanium
subject keywordsHfO<
subject keywordssub>
subject keywordsx<
subject keywords/sub>
subject keywordsRRAM devices
subject keywordsTi
subject keywordscapping layer
subject keywordsmemory performance
subject keywordsoxygen reservoir
subject keywordsresistive random access memory device
subject keywordsresistive switching
subject keywordssize 10 nm
subject keywordssize 8 nm
subject keywordsElectrodes
subject keywordsElectron devices
subject keywordsHafnium compounds
subject keywordsPerformance evaluation
subject keywordsResistance
subject keywordsSwitches
subject keywordsNonvolatile memory
subject keywordsTi capping
subject keywordsTi capping.
subject keywordsresistive random access memory (RRAM)
subject keywordsresistive switching (RS)
identifier doi10.1109/LED.2014.2334311
journal titleElectron Device Letters, IEEE
journal volume35
journal issue9
filesize799218
citations0
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace