Corrosion Studies on Gold-Plated Electrical Contacts
Author:
, , , , ,Publisher:
Year
: 2014DOI: 10.1109/TDMR.2014.2333758
Keyword(s): contact resistance,corrosion,electrical contacts,electroless deposited coatings,gold alloys,integrated circuit packaging,integrated circuit reliability,nickel alloys,palladium alloys,ENIG + EG alternative,Ni-Pd-Au,alternative plating,contact resistance degradation,electrical connector,gold plated electrical contact corrosion,long term reliability,microelectronic package substrate,plating process,Contact resistance,Corrosion,Gold,Nickel,Resistance,Sockets,Substrates,MFG
Collections
:
-
Statistics
Corrosion Studies on Gold-Plated Electrical Contacts
Show full item record
| contributor author | Meyyappan, Karumbu | |
| contributor author | Murtagian, Gregorio | |
| contributor author | Kurella, Anil | |
| contributor author | Pathangey, Balu | |
| contributor author | McAllister, Alan | |
| contributor author | Parupalli, Satish | |
| date accessioned | 2020-03-13T00:13:28Z | |
| date available | 2020-03-13T00:13:28Z | |
| date issued | 2014 | |
| identifier issn | 1530-4388 | |
| identifier other | 6853350.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1138819 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Corrosion Studies on Gold-Plated Electrical Contacts | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8320963 | |
| subject keywords | contact resistance | |
| subject keywords | corrosion | |
| subject keywords | electrical contacts | |
| subject keywords | electroless deposited coatings | |
| subject keywords | gold alloys | |
| subject keywords | integrated circuit packaging | |
| subject keywords | integrated circuit reliability | |
| subject keywords | nickel alloys | |
| subject keywords | palladium alloys | |
| subject keywords | ENIG + EG alternative | |
| subject keywords | Ni-Pd-Au | |
| subject keywords | alternative plating | |
| subject keywords | contact resistance degradation | |
| subject keywords | electrical connector | |
| subject keywords | gold plated electrical contact corrosion | |
| subject keywords | long term reliability | |
| subject keywords | microelectronic package substrate | |
| subject keywords | plating process | |
| subject keywords | Contact resistance | |
| subject keywords | Corrosion | |
| subject keywords | Gold | |
| subject keywords | Nickel | |
| subject keywords | Resistance | |
| subject keywords | Sockets | |
| subject keywords | Substrates | |
| subject keywords | MFG | |
| identifier doi | 10.1109/TDMR.2014.2333758 | |
| journal title | Device and Materials Reliability, IEEE Transactions on | |
| journal volume | 14 | |
| journal issue | 3 | |
| filesize | 2032417 | |
| citations | 1 |