Show simple item record

Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers

contributor authorHeng Yun Zhang
contributor authorXiao Wu Zhang
contributor authorLau, B.L.
contributor authorLim, Sharon
contributor authorLiang Ding
contributor authorYu, M.B.
date accessioned2020-03-12T23:55:22Z
date available2020-03-12T23:55:22Z
date issued2014
identifier issn2156-3950
identifier other6781026.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1128177?show=full
formatgeneral
languageEnglish
publisherIEEE
titleThermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
typeJournal Paper
contenttypeMetadata Only
identifier padid8308271
subject keywordsflip-chip devices
subject keywordsmultichip modules
subject keywordsthermal analysis
subject keywordsthermal management (packaging)
subject keywordsthermal resistance
subject keywordsthree-dimensional integrated circuits
subject keywordsbare die package
subject keywordsdistributed through silicon via network
subject keywordsflip chip bumping process
subject keywordsflip chip joining process
subject keywordsheat density
subject keywordsheterogeneous integration
subject keywordsinterconnect complexity
subject keywordsmultichips module
subject keywordsmultidie temperature monitoring
subject keywordsovermolded 2.5D packages
subject keywordsovermolded package formats
subject keywordssystematic thermal analysis
subject keywordsthermal characterization
subject keywordsthermal measu
identifier doi10.1109/TCPMT.2014.2311587
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue5
filesize2634591
citations0


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record