Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
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سال
: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2311587
کلیدواژه(گان): flip-chip devices,multichip modules,thermal analysis,thermal management (packaging),thermal resistance,three-dimensional integrated circuits,bare die package,distributed through silicon via network,flip chip bumping process,flip chip joining process,heat density,heterogeneous integration,interconnect complexity,multichips module,multidie temperature monitoring,overmolded 2.5D packages,overmolded package formats,systematic thermal analysis,thermal characterization,thermal measu
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Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers
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| contributor author | Heng Yun Zhang | |
| contributor author | Xiao Wu Zhang | |
| contributor author | Lau, B.L. | |
| contributor author | Lim, Sharon | |
| contributor author | Liang Ding | |
| contributor author | Yu, M.B. | |
| date accessioned | 2020-03-12T23:55:22Z | |
| date available | 2020-03-12T23:55:22Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6781026.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1128177 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Thermal Characterization of Both Bare Die and Overmolded 2.5-D Packages on Through Silicon Interposers | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8308271 | |
| subject keywords | flip-chip devices | |
| subject keywords | multichip modules | |
| subject keywords | thermal analysis | |
| subject keywords | thermal management (packaging) | |
| subject keywords | thermal resistance | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | bare die package | |
| subject keywords | distributed through silicon via network | |
| subject keywords | flip chip bumping process | |
| subject keywords | flip chip joining process | |
| subject keywords | heat density | |
| subject keywords | heterogeneous integration | |
| subject keywords | interconnect complexity | |
| subject keywords | multichips module | |
| subject keywords | multidie temperature monitoring | |
| subject keywords | overmolded 2.5D packages | |
| subject keywords | overmolded package formats | |
| subject keywords | systematic thermal analysis | |
| subject keywords | thermal characterization | |
| subject keywords | thermal measu | |
| identifier doi | 10.1109/TCPMT.2014.2311587 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 5 | |
| filesize | 2634591 | |
| citations | 0 |