Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test
نویسنده:
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/GCCE.2014.7031149
کلیدواژه(گان): Certification,Counterfeiting,Cryptography,Educational institutions,Resistance,Simulation,Support vector machines,Physical Unclonable Function,modeling attacks,security,semiconducter counterfeiting
کالکشن
:
-
آمار بازدید
Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test
Show full item record
| contributor author | Kele Shen , Dong Xiang , Zhou Jiang | |
| date accessioned | 2020-03-12T23:39:13Z | |
| date available | 2020-03-12T23:39:13Z | |
| date issued | 2014 | |
| identifier other | 6903361.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1119439?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8289460 | |
| subject keywords | Certification | |
| subject keywords | Counterfeiting | |
| subject keywords | Cryptography | |
| subject keywords | Educational institutions | |
| subject keywords | Resistance | |
| subject keywords | Simulation | |
| subject keywords | Support vector machines | |
| subject keywords | Physical Unclonable Function | |
| subject keywords | modeling attacks | |
| subject keywords | security | |
| subject keywords | semiconducter counterfeiting | |
| identifier doi | 10.1109/GCCE.2014.7031149 | |
| journal title | LSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on | |
| filesize | 868478 | |
| citations | 0 |