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Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

contributor authorKele Shen , Dong Xiang , Zhou Jiang
date accessioned2020-03-12T23:39:13Z
date available2020-03-12T23:39:13Z
date issued2014
identifier other6903361.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1119439?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test
typeConference Paper
contenttypeMetadata Only
identifier padid8289460
subject keywordsCertification
subject keywordsCounterfeiting
subject keywordsCryptography
subject keywordsEducational institutions
subject keywordsResistance
subject keywordsSimulation
subject keywordsSupport vector machines
subject keywordsPhysical Unclonable Function
subject keywordsmodeling attacks
subject keywordssecurity
subject keywordssemiconducter counterfeiting
identifier doi10.1109/GCCE.2014.7031149
journal titleLSI (ISVLSI), 2014 IEEE Computer Society Annual Symposium on
filesize868478
citations0


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