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The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly

contributor authorHo, H.S.Y. , Wang, D. , Johnson, M. , Berry, C.J.
date accessioned2020-03-12T23:32:32Z
date available2020-03-12T23:32:32Z
date issued2014
identifier other6897572.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115386?show=full
formatgeneral
languageEnglish
publisherIEEE
titleThe study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly
typeConference Paper
contenttypeMetadata Only
identifier padid8284824
subject keywordsAntenna arrays
subject keywordsArray signal processing
subject keywordsArrays
subject keywordsOFDM
subject keywordsReceivers
subject keywordsTransmitters
subject keywordsVectors
identifier doi10.1109/WCNC.2014.6951990
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize2867840
citations0


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