The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/WCNC.2014.6951990
کلیدواژه(گان): Antenna arrays,Array signal processing,Arrays,OFDM,Receivers,Transmitters,Vectors
کالکشن
:
-
آمار بازدید
The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly
Show full item record
| contributor author | Ho, H.S.Y. , Wang, D. , Johnson, M. , Berry, C.J. | |
| date accessioned | 2020-03-12T23:32:32Z | |
| date available | 2020-03-12T23:32:32Z | |
| date issued | 2014 | |
| identifier other | 6897572.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1115386 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | The study of bare-die FCBGA die damage in response to applied mechanical stress during heat sink assembly | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8284824 | |
| subject keywords | Antenna arrays | |
| subject keywords | Array signal processing | |
| subject keywords | Arrays | |
| subject keywords | OFDM | |
| subject keywords | Receivers | |
| subject keywords | Transmitters | |
| subject keywords | Vectors | |
| identifier doi | 10.1109/WCNC.2014.6951990 | |
| journal title | lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th | |
| filesize | 2867840 | |
| citations | 0 |