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Low-cost TSH (through-silicon hole) interposers for 3D IC integration

date accessioned2020-03-12T23:32:05Z
date available2020-03-12T23:32:05Z
date issued2014
identifier other6897301.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115122?show=full
formatgeneral
languageEnglish
publisherIEEE
titleLow-cost TSH (through-silicon hole) interposers for 3D IC integration
typeConference Paper
contenttypeMetadata Only
identifier padid8284522
subject keywordsimage classification
subject keywordslearning (artificial intelligence)
subject keywordsobject recognition
subject keywordspattern clustering
subject keywordsGSCDL learning
subject keywordsclassification scheme
subject keywordsclustering algorithm
subject keywordsgroup-based sparse coding dictionary learning
subject keywordsobject recognition
subject keywordsvisual correlation
subject keywordsClassification algorithms
subject keywordsClustering algorithms
subject keywordsDictionaries
subject keywordsEncoding
subject keywordsFeature extraction
subject keywordsTraining
subject keywordsVisualization
subject keywordsClustering Algorithms
subject keywordsDictionary Learning
subject keywordsObject Recognition
subject keywordsSparse Coding
identifier doi10.1109/WARTIA.2014.6976263
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize1531879
citations0
contributor rawauthorLau, J.H. , Ching-Kuan Lee , Chau-Jie Zhan , Sheng-Tsai Wu , Yu-Lin Chao , Ming-Ji Dai , Ra-Min Tain , Heng-Chieh Chien , Chun-Hsien Chien , Ren-Shin Cheng , Yu-Wei Huang , Yuan-Chang Lee , Zhi-Cheng Hsiao , Wen-Li Tsai , Pai-Cheng Chang , Huan-Chun Fu , Yu-Mei Cheng , Li-Ling Liao , Wei-Chung Lo , Ming-Jer Kao


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