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Chip package interaction induced ILD integrity issues in fine pitch flip chip packages

date accessioned2020-03-12T22:53:29Z
date available2020-03-12T22:53:29Z
date issued2014
identifier other7028362.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1098144?show=full
formatgeneral
languageEnglish
publisherIEEE
titleChip package interaction induced ILD integrity issues in fine pitch flip chip packages
typeConference Paper
contenttypeMetadata Only
identifier padid8239221
subject keywordsAccuracy
subject keywordsn Arrays
subject keywordsn Navigation
subject keywordsn Web pages
subject keywordsn Relative information matrix
subject keywordsn Web navigation
subject keywordsn ant colony optimization
subject keywordsn normalization
subject keywordsn web pages content..
subject keywordsn web usability
identifier doi10.1109/ICRAIE.2014.6909295
journal titlelectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
filesize953132
citations0


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