Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
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سال
: 2014شناسه الکترونیک: 10.1109/ICRAIE.2014.6909295
کلیدواژه(گان): Accuracy,n Arrays,n Navigation,n Web pages,n Relative information matrix,n Web navigation,n ant colony optimization,n normalization,n web pages content..,n web usability
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آمار بازدید
Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
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| date accessioned | 2020-03-12T22:53:29Z | |
| date available | 2020-03-12T22:53:29Z | |
| date issued | 2014 | |
| identifier other | 7028362.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1098144 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Chip package interaction induced ILD integrity issues in fine pitch flip chip packages | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8239221 | |
| subject keywords | Accuracy | |
| subject keywords | n Arrays | |
| subject keywords | n Navigation | |
| subject keywords | n Web pages | |
| subject keywords | n Relative information matrix | |
| subject keywords | n Web navigation | |
| subject keywords | n ant colony optimization | |
| subject keywords | n normalization | |
| subject keywords | n web pages content.. | |
| subject keywords | n web usability | |
| identifier doi | 10.1109/ICRAIE.2014.6909295 | |
| journal title | lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th | |
| filesize | 953132 | |
| citations | 0 |