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Sintering of Ag paste for power devices die attach on Cu surfaces

contributor authorManikam, Vemal Raja
contributor authorTolentino, Erik Nino
date accessioned2020-03-12T22:53:19Z
date available2020-03-12T22:53:19Z
date issued2014
identifier other7028252.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1098040?show=full
formatgeneral
languageEnglish
publisherIEEE
titleSintering of Ag paste for power devices die attach on Cu surfaces
typeConference Paper
contenttypeMetadata Only
identifier padid8239070
subject keywordsComputer architecture
subject keywordsn Decoding
subject keywordsn Encoding
subject keywordsn Graphics processing units
subject keywordsn Quantization (signal)
subject keywordsn Convolution Codes
subject keywordsn Error Correcting Codes(ECC)
subject keywordsn Forward Error Correction(FEC)
subject keywordsn GPGPU
subject keywordsn Graphics Core Next(GCN)
subject keywordsn OpenCL
subject keywordsn Viterbi Most-likelihood Decoder
identifier doi10.1109/ICRAIE.2014.6909193
journal titlelectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
filesize374934
citations0


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