Sintering of Ag paste for power devices die attach on Cu surfaces
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: 2014DOI: 10.1109/ICRAIE.2014.6909193
Keyword(s): Computer architecture,n Decoding,n Encoding,n Graphics processing units,n Quantization (signal),n Convolution Codes,n Error Correcting Codes(ECC),n Forward Error Correction(FEC),n GPGPU,n Graphics Core Next(GCN),n OpenCL,n Viterbi Most-likelihood Decoder
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Sintering of Ag paste for power devices die attach on Cu surfaces
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| contributor author | Manikam, Vemal Raja | |
| contributor author | Tolentino, Erik Nino | |
| date accessioned | 2020-03-12T22:53:19Z | |
| date available | 2020-03-12T22:53:19Z | |
| date issued | 2014 | |
| identifier other | 7028252.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1098040 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Sintering of Ag paste for power devices die attach on Cu surfaces | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8239070 | |
| subject keywords | Computer architecture | |
| subject keywords | n Decoding | |
| subject keywords | n Encoding | |
| subject keywords | n Graphics processing units | |
| subject keywords | n Quantization (signal) | |
| subject keywords | n Convolution Codes | |
| subject keywords | n Error Correcting Codes(ECC) | |
| subject keywords | n Forward Error Correction(FEC) | |
| subject keywords | n GPGPU | |
| subject keywords | n Graphics Core Next(GCN) | |
| subject keywords | n OpenCL | |
| subject keywords | n Viterbi Most-likelihood Decoder | |
| identifier doi | 10.1109/ICRAIE.2014.6909193 | |
| journal title | lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th | |
| filesize | 374934 | |
| citations | 0 |