| contributor author | Anopas, D. | |
| contributor author | Wongsawat, Y. | |
| date accessioned | 2020-03-12T22:38:12Z | |
| date available | 2020-03-12T22:38:12Z | |
| date issued | 2014 | |
| identifier other | 7017399.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089504?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Virtual reality game for memory skills enhancement based on QEEG | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227726 | |
| subject keywords | integrated circuit packaging | |
| subject keywords | n organic insulating materials | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 2.5D IC packaging | |
| subject keywords | n 3D IC packaging | |
| subject keywords | n low temperature curable organic insulation materials | |
| subject keywords | n process compatibility | |
| subject keywords | n variable frequency microwave oven | |
| subject keywords | n wafer back side processing | |
| subject keywords | n Chemicals | |
| subject keywords | n Coatings | |
| subject keywords | n Curing | |
| subject keywords | n Materials | |
| subject keywords | n Resistance | |
| subject keywords | n Temperature | |
| subject keywords | n Thermal stability | |
| identifier doi | 10.1109/ECTC.2014.6897544 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 938674 | |
| citations | 1 | |