Virtual reality game for memory skills enhancement based on QEEG
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سال
: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897544
کلیدواژه(گان): integrated circuit packaging,n organic insulating materials,n three-dimensional integrated circuits,n 2.5D IC packaging,n 3D IC packaging,n low temperature curable organic insulation materials,n process compatibility,n variable frequency microwave oven,n wafer back side processing,n Chemicals,n Coatings,n Curing,n Materials,n Resistance,n Temperature,n Thermal stability
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Virtual reality game for memory skills enhancement based on QEEG
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contributor author | Anopas, D. | |
contributor author | Wongsawat, Y. | |
date accessioned | 2020-03-12T22:38:12Z | |
date available | 2020-03-12T22:38:12Z | |
date issued | 2014 | |
identifier other | 7017399.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089504 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Virtual reality game for memory skills enhancement based on QEEG | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8227726 | |
subject keywords | integrated circuit packaging | |
subject keywords | n organic insulating materials | |
subject keywords | n three-dimensional integrated circuits | |
subject keywords | n 2.5D IC packaging | |
subject keywords | n 3D IC packaging | |
subject keywords | n low temperature curable organic insulation materials | |
subject keywords | n process compatibility | |
subject keywords | n variable frequency microwave oven | |
subject keywords | n wafer back side processing | |
subject keywords | n Chemicals | |
subject keywords | n Coatings | |
subject keywords | n Curing | |
subject keywords | n Materials | |
subject keywords | n Resistance | |
subject keywords | n Temperature | |
subject keywords | n Thermal stability | |
identifier doi | 10.1109/ECTC.2014.6897544 | |
journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
filesize | 938674 | |
citations | 1 |