Tackling hillocks growth after aluminum CMP
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Year
: 2014DOI: 10.1109/ECTC.2014.6897410
Keyword(s): curing,n electroplating,n finite element analysis,n polymers,n semiconductor device packaging,n FEM simulation,n bilayer specimen,n built-in strain,n built-in stress,n coefficient of thermal expansion,n electroplating,n flexible substrate,n polymer based electronic,n polymer based packaging substrate,n polymer composite substrate,n silicon substrate,n thin metal film,n thin substrate,n warpage analysis,n Equations,n Films,n Mathemati
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Tackling hillocks growth after aluminum CMP
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| contributor author | Muller, M.R. | |
| contributor author | Kallis, K. | |
| contributor author | Menzel, S. | |
| contributor author | Kunzelmann, U. | |
| contributor author | Petrov, I. | |
| contributor author | Knoch, J. | |
| date accessioned | 2020-03-12T22:37:57Z | |
| date available | 2020-03-12T22:37:57Z | |
| date issued | 2014 | |
| identifier other | 7017263.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089366?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Tackling hillocks growth after aluminum CMP | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227569 | |
| subject keywords | curing | |
| subject keywords | n electroplating | |
| subject keywords | n finite element analysis | |
| subject keywords | n polymers | |
| subject keywords | n semiconductor device packaging | |
| subject keywords | n FEM simulation | |
| subject keywords | n bilayer specimen | |
| subject keywords | n built-in strain | |
| subject keywords | n built-in stress | |
| subject keywords | n coefficient of thermal expansion | |
| subject keywords | n electroplating | |
| subject keywords | n flexible substrate | |
| subject keywords | n polymer based electronic | |
| subject keywords | n polymer based packaging substrate | |
| subject keywords | n polymer composite substrate | |
| subject keywords | n silicon substrate | |
| subject keywords | n thin metal film | |
| subject keywords | n thin substrate | |
| subject keywords | n warpage analysis | |
| subject keywords | n Equations | |
| subject keywords | n Films | |
| subject keywords | n Mathemati | |
| identifier doi | 10.1109/ECTC.2014.6897410 | |
| journal title | lanarization/CMP Technology (ICPT), 2014 International Conference on | |
| filesize | 1145165 | |
| citations | 0 |