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Tackling hillocks growth after aluminum CMP

contributor authorMuller, M.R.
contributor authorKallis, K.
contributor authorMenzel, S.
contributor authorKunzelmann, U.
contributor authorPetrov, I.
contributor authorKnoch, J.
date accessioned2020-03-12T22:37:57Z
date available2020-03-12T22:37:57Z
date issued2014
identifier other7017263.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089366?show=full
formatgeneral
languageEnglish
publisherIEEE
titleTackling hillocks growth after aluminum CMP
typeConference Paper
contenttypeMetadata Only
identifier padid8227569
subject keywordscuring
subject keywordsn electroplating
subject keywordsn finite element analysis
subject keywordsn polymers
subject keywordsn semiconductor device packaging
subject keywordsn FEM simulation
subject keywordsn bilayer specimen
subject keywordsn built-in strain
subject keywordsn built-in stress
subject keywordsn coefficient of thermal expansion
subject keywordsn electroplating
subject keywordsn flexible substrate
subject keywordsn polymer based electronic
subject keywordsn polymer based packaging substrate
subject keywordsn polymer composite substrate
subject keywordsn silicon substrate
subject keywordsn thin metal film
subject keywordsn thin substrate
subject keywordsn warpage analysis
subject keywordsn Equations
subject keywordsn Films
subject keywordsn Mathemati
identifier doi10.1109/ECTC.2014.6897410
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize1145165
citations0


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