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Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP

contributor authorYun Zhuang
contributor authorSampurno, Y.
contributor authorBorucki, L.
contributor authorPhilipossian, A.
date accessioned2020-03-12T22:37:54Z
date available2020-03-12T22:37:54Z
date issued2014
identifier other7017242.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089341?show=full
formatgeneral
languageEnglish
publisherIEEE
titleNovel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP
typeConference Paper
contenttypeMetadata Only
identifier padid8227539
subject keywordsmicroassembling
subject keywordsn three-dimensional integrated circuits
subject keywordsn 3D assembly technology
subject keywordsn 3D compliant chip assembly
subject keywordsn 3D die stacking challenges
subject keywordsn die-to-die assembly
subject keywordsn integrated assembly
subject keywordsn size 300 mm
subject keywordsn wafer-to-wafer assembly
subject keywordsn Assembly
subject keywordsn Bonding
subject keywordsn Flip-chip devices
subject keywordsn Resistance
subject keywordsn Semiconductor device measurement
subject keywordsn Three-dimensional displays
subject keywordsn Through-silicon vias
identifier doi10.1109/ECTC.2014.6897389
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize634488
citations0


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