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Cross-layer optimization schemes based on HARQ for Device-to-Device communication

contributor authorMiao, M.M.
contributor authorSun, J.
contributor authorShao, S.X.
date accessioned2020-03-12T22:37:44Z
date available2020-03-12T22:37:44Z
date issued2014
identifier other7017173.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089261?show=full
formatgeneral
languageEnglish
publisherIEEE
titleCross-layer optimization schemes based on HARQ for Device-to-Device communication
typeConference Paper
contenttypeMetadata Only
identifier padid8227442
subject keywordscopper
subject keywordsn copper compounds
subject keywordsn electroforming
subject keywordsn flexible electronics
subject keywordsn ink jet printing
subject keywordsn random-access storage
subject keywordsn silver
subject keywordsn substrates
subject keywordsn BRS behavior
subject keywordsn Cu-Cu<
subject keywordssub>
subject keywordsx<
subject keywords/sub>
subject keywordsO-Ag
subject keywordsn HRS
subject keywordsn LRS
subject keywordsn data retention performance
subject keywordsn direct current sweep
subject keywordsn ductility
subject keywordsn electroformed memory cell
subject keywordsn electroplate copper electrode
subject keywordsn flexible Kapton substrate
subject keywordsn flexible electronic devices
subject keywordsn flexible nonvolatile ReRAM memory device fabrication
subject keywordsn flexibl
identifier doi10.1109/ECTC.2014.6897321
journal titleomputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE
filesize226994
citations0


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