Cross-layer optimization schemes based on HARQ for Device-to-Device communication
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: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897321
کلیدواژه(گان): copper,n copper compounds,n electroforming,n flexible electronics,n ink jet printing,n random-access storage,n silver,n substrates,n BRS behavior,n Cu-Cu<,sub>,x<,/sub>,O-Ag,n HRS,n LRS,n data retention performance,n direct current sweep,n ductility,n electroformed memory cell,n electroplate copper electrode,n flexible Kapton substrate,n flexible electronic devices,n flexible nonvolatile ReRAM memory device fabrication,n flexibl
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Cross-layer optimization schemes based on HARQ for Device-to-Device communication
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| contributor author | Miao, M.M. | |
| contributor author | Sun, J. | |
| contributor author | Shao, S.X. | |
| date accessioned | 2020-03-12T22:37:44Z | |
| date available | 2020-03-12T22:37:44Z | |
| date issued | 2014 | |
| identifier other | 7017173.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089261 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Cross-layer optimization schemes based on HARQ for Device-to-Device communication | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227442 | |
| subject keywords | copper | |
| subject keywords | n copper compounds | |
| subject keywords | n electroforming | |
| subject keywords | n flexible electronics | |
| subject keywords | n ink jet printing | |
| subject keywords | n random-access storage | |
| subject keywords | n silver | |
| subject keywords | n substrates | |
| subject keywords | n BRS behavior | |
| subject keywords | n Cu-Cu< | |
| subject keywords | sub> | |
| subject keywords | x< | |
| subject keywords | /sub> | |
| subject keywords | O-Ag | |
| subject keywords | n HRS | |
| subject keywords | n LRS | |
| subject keywords | n data retention performance | |
| subject keywords | n direct current sweep | |
| subject keywords | n ductility | |
| subject keywords | n electroformed memory cell | |
| subject keywords | n electroplate copper electrode | |
| subject keywords | n flexible Kapton substrate | |
| subject keywords | n flexible electronic devices | |
| subject keywords | n flexible nonvolatile ReRAM memory device fabrication | |
| subject keywords | n flexibl | |
| identifier doi | 10.1109/ECTC.2014.6897321 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 226994 | |
| citations | 0 |