Committees
| date accessioned | 2020-03-12T22:26:07Z | |
| date available | 2020-03-12T22:26:07Z | |
| date issued | 2014 | |
| identifier other | 7008942.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1082916?show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Committees | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8219547 | |
| subject keywords | ceramic packaging | |
| subject keywords | n cooling | |
| subject keywords | n thermal conductivity | |
| subject keywords | n LTCC-HTCC heterostructure | |
| subject keywords | n electronic microstructures | |
| subject keywords | n heat dissipation | |
| subject keywords | n thermal conductivity | |
| subject keywords | n Cavity resonators | |
| subject keywords | n Conductivity | |
| subject keywords | n Cooling | |
| subject keywords | n Heating | |
| subject keywords | n Substrates | |
| subject keywords | n Thermal conductivity | |
| subject keywords | n Three-dimensional displays | |
| identifier doi | 10.1109/ISSE.2014.6887552 | |
| journal title | olid-State Circuits Conference (A-SSCC), 2014 IEEE Asian | |
| filesize | 154021 | |
| citations | 0 |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
|
There are no files associated with this item. |
|||