Committees
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سال
: 2014شناسه الکترونیک: 10.1109/ISSE.2014.6887552
کلیدواژه(گان): ceramic packaging,n cooling,n thermal conductivity,n LTCC-HTCC heterostructure,n electronic microstructures,n heat dissipation,n thermal conductivity,n Cavity resonators,n Conductivity,n Cooling,n Heating,n Substrates,n Thermal conductivity,n Three-dimensional displays
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Committees
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date accessioned | 2020-03-12T22:26:07Z | |
date available | 2020-03-12T22:26:07Z | |
date issued | 2014 | |
identifier other | 7008942.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1082916 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Committees | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8219547 | |
subject keywords | ceramic packaging | |
subject keywords | n cooling | |
subject keywords | n thermal conductivity | |
subject keywords | n LTCC-HTCC heterostructure | |
subject keywords | n electronic microstructures | |
subject keywords | n heat dissipation | |
subject keywords | n thermal conductivity | |
subject keywords | n Cavity resonators | |
subject keywords | n Conductivity | |
subject keywords | n Cooling | |
subject keywords | n Heating | |
subject keywords | n Substrates | |
subject keywords | n Thermal conductivity | |
subject keywords | n Three-dimensional displays | |
identifier doi | 10.1109/ISSE.2014.6887552 | |
journal title | olid-State Circuits Conference (A-SSCC), 2014 IEEE Asian | |
filesize | 154021 | |
citations | 0 |