Analysis of pre-patterns in the specification of the interaction design for Digital TV
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سال
: 2014شناسه الکترونیک: 10.1109/IITC.2014.6831870
کلیدواژه(گان): CMOS integrated circuits,n integrated circuit interconnections,n three-dimensional integrated circuits,n PMD oxide,n contact protection layer,n keep out zone process development,n middle of line layer stack,n planar CMOS technology,n size 20 nm,n via middle TSV,n Annealing,n Copper,n Silicon,n Tensile stress,n Threshold voltage,n Through-silicon vias
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آمار بازدید
Analysis of pre-patterns in the specification of the interaction design for Digital TV
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contributor author | Mendes, M.S. | |
contributor author | Furtado, E. | |
date accessioned | 2020-03-12T21:54:53Z | |
date available | 2020-03-12T21:54:53Z | |
date issued | 2014 | |
identifier other | 6965149.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1064940 | |
format | general | |
language | English | |
publisher | IEEE | |
title | Analysis of pre-patterns in the specification of the interaction design for Digital TV | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8198140 | |
subject keywords | CMOS integrated circuits | |
subject keywords | n integrated circuit interconnections | |
subject keywords | n three-dimensional integrated circuits | |
subject keywords | n PMD oxide | |
subject keywords | n contact protection layer | |
subject keywords | n keep out zone process development | |
subject keywords | n middle of line layer stack | |
subject keywords | n planar CMOS technology | |
subject keywords | n size 20 nm | |
subject keywords | n via middle TSV | |
subject keywords | n Annealing | |
subject keywords | n Copper | |
subject keywords | n Silicon | |
subject keywords | n Tensile stress | |
subject keywords | n Threshold voltage | |
subject keywords | n Through-silicon vias | |
identifier doi | 10.1109/IITC.2014.6831870 | |
journal title | omputing Conference (CLEI), 2014 XL Latin American | |
filesize | 3391418 | |
citations | 0 |