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Thermomechanical stress analysis of copper/silicon interface in through silicon vias using FEM simulations and experimental analysis

contributor authorRemili, Z.
contributor authorOusten, Y.
contributor authorLevrier, B.
contributor authorMercier, D.
contributor authorSuhir, E.
contributor authorBechou, L.
date accessioned2020-03-12T21:52:42Z
date available2020-03-12T21:52:42Z
date issued2014
identifier other6962839.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063696?show=full
formatgeneral
languageEnglish
publisherIEEE
titleThermomechanical stress analysis of copper/silicon interface in through silicon vias using FEM simulations and experimental analysis
typeConference Paper
contenttypeMetadata Only
identifier padid8196096
subject keywordscloud computing
subject keywordsn educational administrative data processing
subject keywordsn educational institutions
subject keywordsn further education
subject keywordsn knowledge management
subject keywordsn IT
subject keywordsn Indian education sector
subject keywordsn academics
subject keywordsn cloud computing
subject keywordsn cloud ecosystem
subject keywordsn educational institutions
subject keywordsn educational potential
subject keywordsn globalization
subject keywordsn higher education
subject keywordsn information technology
subject keywordsn knowledge base economy
subject keywordsn knowledge management
subject keywordsn knowledge sharing
subject keywordsn knowledge windows
subject keywordsn Cloud computing
subject keywordsn Computation
identifier doi10.1109/IndiaCom.2014.6828132
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize1233131
citations0


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